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AAC 1

CCSS （CoCentric system studio） 1

HuMiX 1

MCF-7细胞球 1

SoC 1

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Tempotron；神经元模型；感受野；高斯差分；图像翻转；图像旋转 1

μ-TAS 1

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低功耗；触发器；隐性；时钟控制技术；双边沿 1

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Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

《机械工程前沿（英文）》 2012年第7卷第1期页码 29-37 doi: 10.1007/s11465-012-0314-7

摘要：

Flip chips are widely used in microelectronics packaging owing to the high demand of integration in IC fabrication. Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chip and substrate. In this paper a nondestructive detection method combining ultrasonic excitation with vibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chip packaging. The flip chip analytical model is revised by considering the influence of spring mass on mechanical energy of the system. This revised model is then applied to estimate the flip chip resonance frequencies. We use an integrated signal generator and power amplifier together with an air-coupled ultrasonic transducer to excite the flip chips. The vibrations are measured by a laser scanning vibrometer to detect the resonance frequencies. A sensitivity coefficient is proposed to select the sensitive resonance frequency order for defect detection. Finite element simulation is also implemented for further investigation. The results of analytical computation, experiment, and simulation prove the efficacy of the revised flip chip analytical model and verify the effectiveness of this detection method. Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection systems.

关键词： flip chip defect detection ultrasonic excitation vibration analysis

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Numerical modeling of cavitation on spillway’s flip bucket

Abbas PARSAIE,Sadegh DEHDAR-BEHBAHANI,Amir Hamzeh HAGHIABI

《结构与土木工程前沿（英文）》 2016年第10卷第4期页码 438-444 doi: 10.1007/s11709-016-0337-y

摘要： Numerical modeling of hydraulic phenomenon by computational fluid dynamic (CFD) approaches is one of the main parts in the high cost hydraulic structure studies. In this paper, using Flow 3D as CFD commercial tool, the cavitation phenomenon was assessed along spillway's flip bucket of the Balaroud dam. Performance of numerical modeling was compared to the physical model, which was constructed to this purpose. During numerical modeling, it was found that RNG turbulence model is a suitable performance for modeling the cavitation. Physical modeling shows that minimum cavitation index is about 0.85 and minimum cavitation index based on Flow 3D results is about 0.665, which was related to the flood discharge with return period of 10000 years. The main difference between numerical and physical modeling is related to the head of velocity, which is considered in physical modeling. Results of numerical simulation show that occurrence of cavitation based on cavitation index equal to 0.25 is not possible along the spillway.

关键词： cavitation Index numerical simulation spillway’s flip Bucket CFD Balaroud Dam physical modeling

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采用内嵌时钟控制技术的低功耗双边沿隐形脉冲触发器 Article

Liang GENG,Ji-zhong SHEN,Cong-yuan XU

《信息与电子工程前沿（英文）》 2016年第17卷第9期页码 962-972 doi: 10.1631/FITEE.1500293

摘要：概要：本文提出了一种新颖的采用内嵌时钟控制技术的双边沿隐形脉冲触发器（dual-edge implicit pulse-triggered flip-flop with an embedded clock-gating

关键词：低功耗；触发器；隐性；时钟控制技术；双边沿

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Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

《机械工程前沿（英文）》 2013年第8卷第2期页码 118-126 doi: 10.1007/s11465-013-0253-y

摘要：

To enhance the performance of high speed transfer system of LED chip sorting equipment, its control parameters need to be well matching with the mechanical system. In practical issues, it is difficult and time-consuming work to get these parameters matched because their selection is strongly depended on individuals. In current work, an integrated optimization method was carried out to solve this problem, in which the multiple control parameters optimization, modeling and simulation were included, i.e., a multi-domain model of transfer system performed on Dymola platform. Based on this model, the searching area of the key control parameters was narrowed by performing integrated optimization. After that a group of parameters were selected from this narrowed area to perform the equipment’s controls. The result showed this method possesses a simple and reliable nature. The optimal solutions also indicated that the optimized control parameters can well satisfy the requirements of transfer system. On the other hand, it greatly reduced the engineering adjustment time by using this method.

关键词： LED chip sorter multi-domain modeling and simulation parameter optimization modelica language

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Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

《机械工程前沿（英文）》 2017年第12卷第4期页码 581-590 doi: 10.1007/s11465-017-0454-x

摘要：

This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0–50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measurement errors of the three electrostatic field components are less than 14.04%.

关键词： electric field microsensor three-dimensional single-chip in-plane rotation

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Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

《机械工程前沿（英文）》 2009年第4卷第4期页码 472-472 doi: 10.1007/s11465-009-0077-y

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SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS

《农业科学与工程前沿（英文）》 2023年第10卷第3期页码 448-457 doi: 10.15302/J-FASE-2023490

摘要：

● Low-value biowaste including wood chip and potato peel was valorized to syngas.

关键词： Aspen Plus co-gasification potato peel syngas simulation waste reduction wood chip

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3D finite element prediction of chip flow, burr formation, and cutting forces in micro end-milling of

A. DAVOUDINEJAD, P. PARENTI, M. ANNONI

《机械工程前沿（英文）》 2017年第12卷第2期页码 203-214 doi: 10.1007/s11465-017-0421-6

摘要：

Predictive models for machining operations have been significantly improved through numerous methods in recent decades. This study proposed a 3D finite element modeling (3D FEM) approach for the micro end-milling of Al6061-T6. Finite element (FE) simulations were performed under different cutting conditions to obtain realistic numerical predictions of chip flow, burr formation, and cutting forces. FE modeling displayed notable advantages, such as capability to easily handle any type of tool geometry and any side effect on chip formation, including thermal aspect and material property changes. The proposed 3D FE model considers the effects of mill helix angle and cutting edge radius on the chip. The prediction capability of the FE model was validated by comparing numerical model and experimental test results. Burr dimension trends were correlated with force profile shapes. However, the FE predictions overestimated the real force magnitude. This overestimation indicates that the model requires further development.

关键词： 3D finite element modeling micro end-milling cutting force chip formation burr formation

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用于器官芯片的工程化血管系统 Review

Abdellah Aazmi, 周竑钊, 李雨亭, 俞梦飞, 许晓斌, 吴钰桐, 马梁, 张斌, 杨华勇

《工程（英文）》 2022年第9卷第2期页码 131-147 doi: 10.1016/j.eng.2021.06.020

摘要：

器官芯片技术是一种很有前途的三维（3D）动态培养方法，可确保准确高效的细胞培养，在临床前试验中具有替代动物模型的巨大潜力。血管系统是人体内最丰富的器官，在氧气交换和物质传递中起着至关重要的作用，是组织器官生存的决定性因素。因此，必须将血管系统集成到器官芯片中，以重建组织和器官微环境及其生理功能。本文讨论了血管与新兴器官芯片技术之间的协同作用，为复现生理学和疾病特征提供了更好的可能性。此外，回顾了血管化的器官芯片制造过程的不同步骤，包括使用不同生物制造策略的结构制造和组织构建。最后，概述了这项技术在器官和肿瘤培养这个有极具吸引力且快速发展的领域的适用性。

关键词：器官芯片血管生物打印肿瘤芯片

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三维芯片成像

Marcus Woo

《工程（英文）》 2020年第6卷第5期页码 485-486 doi: 10.1016/j.eng.2020.03.009

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Development of electrorheological chip and conducting polymer-based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

《机械工程前沿（英文）》 2009年第4卷第4期页码 393-396 doi: 10.1007/s11465-009-0043-8

摘要： This paper presents the development of an integrated sensor using two types of smart materials: electrorheological (ER) fluids and conducting polymers (CPs). The developed ER chip worked as an actuator, and it was driven by different voltages and control frequencies. When the four electrodes are controlled synchronously, the diaphragm acts as a vibrator whose frequency can be adjusted in accordance with the frequency of the electrical signals. The response signals of the CP sensor were recorded, and its properties were analyzed. Experimental results show that the amplitude decreases monotonically when the frequency increases, owing to the time delay in the pressure buildup in the ER chip. However, the displacement fluctuation of the diaphragm below 20Hz can be detected clearly even if the value is very low. When the vibration frequency is larger than 20Hz, the CP sensor can hardly detect the displacement fluctuation. Thus, the upper limit frequency that the CP sensor can detect is about 20Hz. The practical applications of this microdevice are also discussed.

关键词： electrorheological (ER) fluids conducting polymer (CP) polydimethylsioxane (PDMS) driving frequency amplitude bubble counter

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机器学习推动人类芯片设计

Robert Pollie

《工程（英文）》 2022年第10卷第3期页码 7-9 doi: 10.1016/j.eng.2022.01.006

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分析芯片微通道制作技术进展

魏守水,张玉林,崔大付

《中国工程科学》 2004年第6卷第10期页码 90-94

摘要：

微通道制作是微分析芯片制作中的关键技术之一。就选取材料的原则，模板复制中的模具制造技术及微通道直接加工方法做了比较，提出了微流体芯片产业化的可行性方案。

关键词：分析芯片微细加工 μ-TAS

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Biological chip technology to quickly batch select optimum cryopreservation procedure

YU Lina, LIU Jing, ZHOU Yixin, HUA Zezhao

《能源前沿（英文）》 2007年第1卷第3期页码 316-321 doi: 10.1007/s11708-007-0046-2

摘要： In the practices of cryobiology, selection of an optimum freeze/thawing program and an idealistic cryoprotective agent often requires rather tedious, time consuming and repetitive tests. Integrating the functions of sample preparation and viability detection, the concept of biochip technology was introduced to the field of cryopreservation, aiming at quickly finding an optimum freezing and thawing program. Prototype devices were fabricated and corresponding experimental tests were performed. It was shown that microflow-channel chip could not offer a high quality solution distribution. As an alternative, the spot-dropping chip proved to be an excellent way to load the sample quickly and reliably. Infrared thermal mapping on such a chip showed that it had a rather uniform heat transfer boundary. Applying the spot-dropping chip combined with the thermoelectric cooling device, the final output of cryopreservation of multiple samples was tested, and the optimal freeze/thawing program as well as the potentially best concentration of the cryoprotective agent was found by analyzing the results. Further, application of this technique to measure the thermo-physical properties of the cryo-protective agent was also investigated. The study demonstrated that a biochip with integrated automatic loading and inspection units opens the possibility of a massive optimization of the complex cryopreservation program in a quicker and more economical way.

关键词： idealistic cryoprotective concentration Prototype technology alternative

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System-level Pareto frontiers for on-chip thermoelectric coolers

Sevket U. YURUKER, Michael C. FISH, Zhi YANG, Nicholas BALDASARO, Philip BARLETTA, Avram BAR-COHEN, Bao YANG

《能源前沿（英文）》 2018年第12卷第1期页码 109-120 doi: 10.1007/s11708-018-0540-8

摘要： The continuous rise in heat dissipation of integrated circuits necessitates advanced thermal solutions to ensure system reliability and efficiency. Thermoelectric coolers are among the most promising techniques for dealing with localized on-chip hot spots. This study focuses on establishing a holistic optimization methodology for such thermoelectric coolers, in which a thermoelectric element’s thickness and the electrical current are optimized to minimize source temperature with respect to ambient, when the thermal and electrical parasitic effects are considered. It is found that when element thickness and electrical current are optimized for a given system architecture, a “heat flux vs. temperature difference” Pareto frontier curve is obtained, indicating that there is an optimum thickness and a corresponding optimum current that maximize the achievable temperature reduction while removing a particular heat flux. This methodology also provides the possible system level Δ ’s that can be achieved for a range of heat fluxes, defining the upper limits of thermoelectric cooling for that architecture. In this study, use was made of an extensive analytical model, which was verified using commercially available finite element analysis software. Through the optimization process, 3 pairs of master curves were generated, which were then used to compose the Pareto frontier for any given system architecture. Finally, a case study was performed to provide an in-depth demonstration of the optimization procedure for an example application.

关键词： thermoelectric cooling thermal management optimization high flux electronics